A silica-based CMP polishing liquid, characterized in that the polishing liquid contains 10-50% by weight of nano-silica abrasives, 0.1-10% of a dispersant, and 0.1-10% of a wetting agent. 0.1 to 10% of the chelating agent, 0.01 to 1% of the pH regulator, the rest is deionized water.
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