LCD Grinding and Polishing Film This series of products use advanced precision coating technology to uniformly disperse micro / nano-scale abrasives (diamond, alumina, silicon carbide, silicon dioxide, cerium oxide, etc.) and new polymer materials, then apply High-strength flexible film substrate surface.
Product features:
1. The abrasive used is specially treated to completely remove oversized particles without causing scratches.
2. Adopt proprietary dispersion and coating technology to ensure that the abrasive particles can be evenly coated on the belt substrate.
3. Quality control throughout the process to ensure product consistency.
4. Specific good flexibility and high strength can maximize the grinding quality.
5. It has high grinding force and high polishing efficiency.
6. Good durability and long service life, which can greatly reduce production costs.
7. Suitable for dry and wet polishing modes.
|
Mesh |
600 |
800 |
1000 |
1200 |
1500 |
2000 |
2500 |
3000 |
|
Particle size/um |
30 |
20 |
16 |
15 |
12 |
9 |
6 |
5 |
|
Mesh |
4000 |
6000 |
7000 |
8000 |
10000 |
15000 |
20000 |
30000 |
|
Particle size/um |
3 |
2 |
1.5 |
1 |
0.5 |
0.3 |
0.2 |
0.1 |
|
Abrasive type |
Diamond (D), Silicon Carbide (SC), Aluminum Oxide (AO), Silicon Oxide (SO), Cerium Oxide (CO) |
|
Specification |
Round abrasive sheet：Φ70mm、Φ110mm、Φ127mm、Φ203mm |
|
Square abrasive sheet：114mm*114mm、152mm*152mm、228mm*228mm |
Note: In addition to the above specifications, various specifications can be customized according to customer needs.
