Quality of raw materials and establishment of   quality traceability system

Features
1. Fine texture, excellent flatness, no hair removal;
2. High removal rate;
3. Excellent polishing repeatability and stable performance;
4. Mirror effect without scratches and orange peel after polishing.


Application area
GRISH polishing pads are used for the final CMP polishing of hard and brittle materials such as sapphire and silicon wafers. They can also be used for mirror polishing of metal materials such as stainless steel and aluminum alloy.

Project	Specifications	Test Methods
Thickness (mm)	1.4±0.1	Vernier caliper measurement
Hardness	60±2	Shore (A) hardness tester
Hole depth (mm)	0.37	No significant difference between the samples at 200x magnification
Compression ratio (percent)	9	-
Velvet length (mm)	0.4±0.05	No significant difference between the samples at 200x magnification
Size (mm)	Φ（920±2）	Tape measure

Note 1: We can provide polishing pad products of different thicknesses and sizes according to customer requirements;
Note 2: Slotting and adhesive treatment can be performed according to customer needs.